Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution

被引：155

作者：

Iliescu, C

Jing, J

Tay, FEH

Miao, JM

Sun, TT

机构：

[1] Inst Bioengn & Nanotechnol, Singapore 138669, Singapore

[2] Natl Univ Singapore, Dept Engn Mech, Singapore 117548, Singapore

[3] Nanyang Technol Univ, Sch Mech & Prod Engn, Micromachines Ctr, Singapore, Singapore

[4] Shanghai Jiao Tong Univ, Dept Phys, Shanghai 200030, Peoples R China

来源：

SURFACE & COATINGS TECHNOLOGY | 2005年 / 198卷 / 1-3期

关键词：

wet etching of glass; surface roughness; masking layers;

D O I：

10.1016/j.surfcoat.2004.10.094

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The paper presents a solution for improving the quality of the surface generated during deep wet etching of glass using an HF (49%)/HCl (37%) solution in a volumetric ratio 10:1. Pyrex glass (Coming 7740) and soda lime glass were analyzed. In addition, the characterization of the main masking layers, including photoresist, amorphous silicon, polysilicon and Cr/Au for deep wet etching in the optimal solution, is described. Published by Elsevier B.V.

引用

页码：314 / 318

页数：5

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