A Junction Temperature-based PSpice Short-circuit Model of SiC MOSFET Considering Leakage Current

被引:0
作者
Li, Hong [1 ]
Wang, Yuting [1 ]
Zhao, Xingran [1 ]
Sun, Kai [2 ]
Zhou, Zhe [3 ]
Xu, Yunfei [4 ]
机构
[1] Beijing Jiaotong Univ, Sch Elect Engn, Beijing, Peoples R China
[2] Tsinghua Univ, Dept Elect Engn, Beijing, Peoples R China
[3] Global Energy Interconnect Res Inst, State Key Lab Adv Power Transmiss Technol, Power Elect Dept, Beijing, Peoples R China
[4] Global Energy Interconnect Res Inst, State Key Lab Adv Power Transmiss Technol, Beijing, Peoples R China
来源
45TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2019) | 2019年
基金
中国国家自然科学基金;
关键词
SiC MOSFET; short-circuit model; leakage current; junction temperature; DEVICES;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to estimate the short-circuit capability of SiC MOSFET-based power converter, this paper proposes a behavioral model of SiC MOSFET that can be used for short-circuit simulation in PSpice, and the leakage current generated during short circuit is considered, which is an early warning of device failure. The short-circuit characteristic of SiC MOSFET is discussed and analyzed, and a thermal model of case-to-junction is built to describe the junction temperature of SiC MOSFET during short-circuit condition. Based on the junction temperature information, the channel current model and leakage current model are established respectively. The simulation results show that the short-circuit model can correctly reflect the static characteristic and short-circuit characteristic of SiC MOSFET. This circuit model can provide guidance for the design of short circuit protection circuit.
引用
收藏
页码:5095 / 5100
页数:6
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