Thermal performance of flat vapor chamber heat spreader

被引：81

作者：

Hsieh, Shou-Shing ^{[1
]}

Lee, Ron-Yu ^{[1
]}

Shyu, Jin-Cherng ^{[2
]}

Chen, Shao-Wen ^{[2
]}

机构：

[1] Natl Sun Yat Sen Univ, Dept Mech & Electromech Engn, Kaohsiung 80424, Taiwan

[2] Ind Technol Res Inst, Microsyst Technol Ctr, Tainan 70955, Taiwan

来源：

ENERGY CONVERSION AND MANAGEMENT | 2008年 / 49卷 / 06期

关键词：

IC cooling technology; vapor chamber heat spreader; evaporation and condensation;

D O I：

10.1016/j.enconman.2007.10.024

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Experiments were performed to examine the spreading thermal resistance of centrally positioned heat sources and the thermal performance of a water charged, gravity assisted flat vapor chamber to be used for electronic cooling. Parametric studies including different heat fluxes and operating temperatures were conducted, and the effect of the relevant parameters on the cooling performance in terms of the spreading resistance was presented and discussed. The present vapor chamber heat spreader showed a heat removal capacity of 220 W/cm(2) with a thermal spreading resistance of 0.2 degrees C/W. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：1774 / 1784

页数：11

共 7 条

[1] An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling [J].

Feng, TQ ;

Xu, JL .

APPLIED THERMAL ENGINEERING, 2004, 24 (2-3) :323-337

[2] Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling [J].

Go, JS .

SENSORS AND ACTUATORS A-PHYSICAL, 2005, 121 (02) :549-556

[3] Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar [J].

Hsieh, Shou-Shing ;

Lee, Ron-Yu ;

Shyu, Jin-Cherng ;

Chen, Shao-Wen .

ENERGY CONVERSION AND MANAGEMENT, 2007, 48 (10) :2708-2717

[4]

MEHL D, VAPOR CHAMBER HEAT S

[5] Thermal spreading resistance of eccentric heat sources on rectangular flux channels [J].

Muzychka, YS ;

Culham, JR ;

Yovanovich, MM .

JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (02) :178-185

[6] Spreading in the heat sink base: Phase change systems or solid metals?? [J].

Sauciuc, I ;

Chrysler, G ;

Mahajan, R ;

Prasher, R .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (04) :621-628

[7]

Simons R. E., 2004, ELECT COOL

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