Highly Conductive Three-Dimensional Printing With Low-Melting Metal Alloy Filament

被引：16

作者：

Andersen, Kimball ^{[1
]}

Dong, Yue ^{[1
]}

Kim, Woo Soo ^{[1
]}

机构：

[1] Simon Fraser Univ, Stretchable Device Lab, Sch Mechatron Syst Engn, Surrey, BC V3T 0A3, Canada

来源：

ADVANCED ENGINEERING MATERIALS | 2017年 / 19卷 / 11期

基金：

加拿大自然科学与工程研究理事会;

关键词：

3D printing; fused filament fabrication; low-melting metal alloy filament; metal 3D printing; multi-material printing; rapid prototyping;

D O I：

10.1002/adem.201700301

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It has been challenging to develop a new functional material with high conductivity for the Fused Filament Fabrication (FFF) based 3D printing technology. The proposed low-melting metal alloy filament provides the key to overcome the challenges including printability and conductivity. For this report, two metal alloys are designed to evaluate their suitability for FFF. In order to achieve material compatibility of the designed filament material with the nozzle materials, different nozzle materials are also investigated using thermal analysis. Then, a custom extrusion nozzle is suggested using thermal modeling to optimize the melt-zone for reliable extrusion. And finally, 3D printed circuit is demonstrated from a 3D printed plastic case to the integrated printed-alloy connections for the light-emitting device.

引用

页数：7

共 23 条

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[2]

[Anonymous], ACS APPL MAT INTERFA

[3]

[Anonymous], 2012, P SOL FREE FABR S

[4] Modelling the semisolid processing of metallic alloys [J].