Deposition of diamond in copper by triboadhesion

被引：4

作者：

Lelis, JMR ^{[1
]}

Ocempo, JC ^{[1
]}

Calderón, JP ^{[1
]}

Robles, JM ^{[1
]}

机构：

[1] Ctr Nacl Invest Desarrollo Tecnol, Dept Ingn Mecan, Cuernavaca 62490, Morelos, Mexico

来源：

JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME | 2003年 / 125卷 / 03期

关键词：

D O I：

10.1115/1.1557297

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.

引用

页码：628 / 630

页数：3