Numerical method for a 2D drift diffusion model arising in strained n-type MOSFET device

This paper reports the calculation of electron transport in metal oxide semiconductor field effects transistors (MOSFETs) with biaxially tensile strained silicon channel. The calculation is formulated based on two-dimensional drift diffusion model (DDM) including strain effects. The carrier mobility dependence on the lateral and vertical electric field model is especially considered in the formulation. By using the model presented here, numerical method based on finite difference approach is performed. The obtained results show that the presence of biaxially tensile strain enhances the current in the devices.