共 10 条
[1]
BORUCKI SV, 2001, SURF COAT TECH, V138, P256
[2]
MINIMIZING WAFER SURFACE DAMAGE AND CHAMBER MATERIAL CONTAMINATION IN NEW PLASMA PROCESSING EQUIPMENT
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS,
1990, 29 (12)
:L2395-L2397
[5]
The effect of Ar+ ion bombardment on SiO2 aerogel film
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1998, 37 (12B)
:6955-6958
[7]
LIDE DR, 1995, HDB CHEM PHYSICS
[8]
Low dielectric constant materials for ULSI interconnects
[J].
ANNUAL REVIEW OF MATERIALS SCIENCE,
2000, 30
:645-680
[9]
NIZNANSKY D, 1995, J NONCRYST SOLIDS, V180, P196
[10]
Samson J. A., 1967, TECHNIQUES VACUUM UL