Submicron InP/InGaAs Composite Channel MOSFETs with Selectively Regrown N+-Source/Drain Buried in Channel Undercut

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作者
Kanazawa, Toru [1 ]
Wakabayashi, Kazuya [1 ]
Saito, Hisashi [1 ]
Terao, Ryosuke [1 ]
Tajima, Tomonori [1 ]
Ikeda, Shunsuke [1 ]
Miyamoto, Yasuyuki [1 ]
Furuya, Kazuhito [1 ]
机构
[1] Tokyo Inst Technol, Dept Phys Elect, Meguro Ku, Tokyo 1528552, Japan
来源
2010 22ND INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS (IPRM) | 2010年
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrated a high-mobility InP 5 nm/InGaAs 12 nm composite channel MOSFET with MOVPE regrown n(+)-source/drain region for low series resistance and high source injection current. A gate dielectric was SiO2 and thickness was 20 nm. A carrier density of regrown InGaAs source/drain layer was over 4 x 10(19) cm(-3). In the measurement of submicron (= 150 nm) device, the drain current was 0.93 mA/mu m at V-g = 3 V, V-d = 1 V and the peak transconductance was 0.53 mS/mu m at V-d = 0.65 V, respectively. The channel length dependence of transconductance indicated the good relativity.
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页数:4
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