Characteristics of SiC MOSFET in a Wide Temperature Range

被引:3
作者
Zhu, Mengyu [1 ]
Wang, Laili [1 ]
Li, Huaqing [1 ]
Yang, Chengzi [1 ]
Ma, Dingkun [1 ]
Yang, Fengtao [1 ]
机构
[1] Xi An Jiao Tong Univ, Coll Artificial Intelligence, Xian, Peoples R China
来源
2021 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2021) | 2021年
关键词
SiC MOSFET; SiC SBD; high temperature;
D O I
10.1109/WIPDAASIA51810.2021.9656056
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In order to expand the application of SiC MOSFET in a wide temperature range, the performance of SiC MOSFET from 25 degrees C to 425 degrees C is studied in this paper by taking the 1.2 kV QPM3-1200-0013D as an example. Different from the device characteristics given in the data sheet or previous articles at only three discrete temperatures or temperatures below 250 degrees C, the temperature-dependent static characteristics of SiC MOSFET are remeasured and nonlinearly characterized in a wide temperature range in this paper. In addition, considering the improvement effect of SiC Schottky barrier diode on reliability of SiC MOSFET's body diode, the temperature-dependent static characteristics of SiC Schottky barrier diode are also analyzed in this paper, which provides guidance for the high-temperature pre-design and application of SiC MOSFET.
引用
收藏
页码:79 / 82
页数:4
相关论文
共 10 条
[1]   Failure of Switching Operation of SiC-MOSFETs and Effects of Stacking Faults on Safe Operation Area [J].
Fujita, Ryusei ;
Tani, Kazuki ;
Konishi, Kumiko ;
Shima, Akio .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (10) :4448-4454
[2]   Power conversion with SiC devices at extremely high ambient temperatures [J].
Funaki, Tsuyoshi ;
Balda, Juan Carlos ;
Junghans, Jeremy ;
Kashyap, Avinash S. ;
Mantooth, H. Alan ;
Barlow, Fred ;
Kimoto, Tsunenobu ;
Hikihara, Takashi .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2007, 22 (04) :1321-1329
[3]   Diode-Less SiC Power Module With Countermeasures Against Bipolar Degradation to Achieve Ultrahigh Power Density [J].
Ishigaki, Takashi ;
Hayakawa, Seiichi ;
Murata, Tatsunori ;
Masuda, Toru ;
Oda, Tetsuo ;
Takayanagi, Yuji .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (05) :2035-2043
[4]   Temperature-Dependent Characterization, Modeling, and Switching Speed-Limitation Analysis of Third-Generation 10-kV SiC MOSFET [J].
Ji, Shiqi ;
Zheng, Sheng ;
Wang, Fei ;
Tolbert, Leon M. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 33 (05) :4317-4327
[5]   A Physics-Based Compact Model of SiC Power MOSFETs [J].
Kraus, Rainer ;
Castellazzi, Alberto .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2016, 31 (08) :5863-5870
[6]   A Non-Segmented PSpice Model of SiC MOSFET With Temperature-Dependent Parameters [J].
Li, Hong ;
Zhao, Xingran ;
Sun, Kai ;
Zhao, Zhengming ;
Cao, Guoen ;
Zheng, Trillion Q. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2019, 34 (05) :4603-4612
[7]   Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect [J].
Spry, David J. ;
Neudeck, Philip G. ;
Chen, Liangyu ;
Lukco, Dorothy ;
Chang, Carl W. ;
Beheim, Glenn M. .
IEEE ELECTRON DEVICE LETTERS, 2016, 37 (05) :625-628
[8]   Accurate Temperature Estimation of SiC Power MOSFETs Under Extreme Operating Conditions [J].
Tsibizov, Alexander ;
Kovacevic-Badstuebner, Ivana ;
Kakarla, Bhagyalakshmi ;
Grossner, Ulrike .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2020, 35 (02) :1855-1865
[9]  
Yuan L., 2020, IEEE J EM SEL TOP P, P1
[10]   Coordinated Flexible Damping Mechanism With Inertia Emulation Capability for MMC-MTDC Transmission Systems [J].
Zhu, Jiebei ;
Shen, Zhipeng ;
Bu, Siqi ;
Li, Xialin ;
Booth, Campbell D. ;
Qiu, Wei ;
Jia, Hongjie ;
Wang, Chengshan .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2021, 9 (06) :7329-7342