Complexes of imidazole with poly(ethylene glycol)s as the thermal latency catalysts for epoxy-phenolic resins

被引：23

作者：

Chen, Kun-Lung ^{[2
]}

Shen, Yun-Hwei ^{[2
]}

Yeh, Mou-Yung ^{[3
]}

Wong, Fung Fuh ^{[1
]}

机构：

[1] China Med Univ, Grad Inst Pharmaceut Chem, Taichung 40402, Taiwan

[2] Natl Cheng Kung Univ, Dept Resources Engn, Tainan 70101, Taiwan

[3] Natl Cheng Kung Univ, Dept Chem, Tainan 70101, Taiwan

来源：

JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS | 2012年 / 43卷 / 02期

关键词：

PEGs; Imidazole; Thermal latent catalyst; Epoxy-phenolic resin; Polymerization; Thermoset; C-H BONDS; ORGANIC-SYNTHESIS; MECHANICAL-PROPERTIES; POLYMERIC SUPPORTS; METAL-COMPLEXES; CURE KINETICS; SYSTEMS; EPOXIDES; BEHAVIOR; LINKER;

D O I：

10.1016/j.jtice.2011.08.007

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

lmidazole with various molecular weights poly(ethylene glycol)s, including PEG1000, PEG2000, and PEG5000, was blended and evaluated as thermal latent catalysts for the polymerization of diglycidyl ether of bisphenol A (DGEBA) under liquid-liquid or liquid-solid two phase systems. The thermal latency and storage stability properties of DGEBA resin cured by 1-5 wt% of molecular weight imidazole/PEG complexes were measured by viscometer, differential scanning calorimetry (DSC), and TGA. Based on the viscosity-shear rate results, we found the 1-3 wt% amount of imidazole/PEGs showed the better thermal latency in the thermal polymerization system. From the cure activation energy and the viscosity-storage time of these complex catalysts, the order of thermally latent activity was imidazole/PEG1000 (2) > imidazole/PEG5000 (4) > imidazole/PEG2000 (3) > imidazole. Concerning the glass transition temperature (T-g), the use of imidazole/PEG complex catalysts provided complete or near complete curing systems in the temperature range about 150 degrees C. Crown Copyright (C) 2011 Taiwan Institute of Chemical Engineers. Published by Elsevier B.V. All rights reserved.

引用

页码：306 / 312

页数：7

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