Review on three-dimensional ceramic filler networking composites for thermal conductive applications

被引：36
作者：
Yoon, Hyungsub [1 ]
Matteini, Paolo [2 ]
Hwang, Byungil [1 ]
机构：
[1] Chung Ang Univ, Sch Integrat Engn, Seoul 06974, South Korea
[2] CNR, Inst Appl Phys Nello Carrara, Via Madonna Piano 10, I-50019 Sesto Fiorentino, Italy
来源：
JOURNAL OF NON-CRYSTALLINE SOLIDS | 2022年 / 576卷
基金：
新加坡国家研究基金会;
关键词：
Thermally conductive composites; Ceramic-based composites; Polymer-matrix composites; Manufacturing; Processing; HEXAGONAL BORON-NITRIDE; BINARY-PARTICLE SYSTEM; EPOXY-RESIN COMPOSITES; PHASE-CHANGE MATERIALS; MECHANICAL-PROPERTIES; POLYMER COMPOSITES; ALUMINUM NITRIDE; SILICON-CARBIDE; THERMOPLASTIC COMPOSITES; MANAGEMENT-SYSTEM;
D O I：
10.1016/j.jnoncrysol.2021.121272
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Three-dimensional (3D) ceramic filler networking composites feature isotropic heat dissipation properties owing to the spatial distribution of their fillers, which form continuous thermal conduction paths that ensure a high thermal conductivity. Therefore, this type of filler networking is considered ideal in thermally conductive ceramic-filler-based composites. This review discusses the research advances achieved thus far for improving the heat dissipation properties of thermally conductive ceramic filler networking composites, with a special focus on structural engineering applications. The most popular methods for fabricating composites with 3D filler networking are also examined. Finally, existing issues and future perspectives associated with the use of these composites are considered.
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收藏
页数：27
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