Signal Integrity Verification of Multichip Links Using Passive Channel Macromodels

被引:18
作者
Chinea, Alessandro [1 ]
Grivet-Talocia, Stefano [1 ]
Hu, Haisheng [1 ]
Triverio, Piero [1 ]
Kaller, Dierk [2 ]
Siviero, Claudio [2 ]
Kindscher, Martin [2 ]
机构
[1] Politecn Torino, Dept Elect, I-10129 Turin, Italy
[2] IBM Deutschland Res & Dev GmbH, IBM Syst & Technol Grp, D-71032 Boblingen, Germany
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2011年 / 1卷 / 06期
关键词
Delay extraction; high-speed interconnects; macromodeling; passivity; rational approximations; scattering parameters; RATIONAL APPROXIMATION; TRANSIENT SIMULATION; FREQUENCY; IDENTIFICATION; ENFORCEMENT; PERTURBATION; NETWORKS;
D O I
10.1109/TCPMT.2011.2138136
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents a general strategy for the electrical performance and signal integrity assessment of electrically long multichip links. A black-box time-domain macromodel is first derived from tabulated frequency responses in scattering form. This model is structured as a combination of ideal delay terms with frequency-dependent rational coefficients. A new identification scheme is presented, which is based on an initial blind delay estimation process followed by a refinement loop based on an iterative delayed vector fitting process. Two alternative passivity enforcement schemes based on local perturbations are then presented. The result is an accurate and guaranteed passive delay-based macromodel, which is synthesized as a SPICE-compatible netlist for channel analysis. The proposed procedure enables safe and reliable circuit-based transient simulations of complex multichip links, including nonlinear drivers and receivers. The performance of the proposed flow is demonstrated on a large number of channel benchmarks.
引用
收藏
页码:920 / 933
页数:14
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