Description of temperature dependence and creep deformation of 60 Sn-40Pb solder alloys

This paper shows the temperature effect on the deformation of 60 Sn-40 Ph solder alloys and a simulation using a constitutive model for viscoplasticity. First, a series of tests, such as creep, pure tension, and cyclic tension-compression loading were conducted to clarify the temperature effect on the deformation of 60 Sn-40 Pb solder alloys. The test results showed that the deformation of the solder alloys has a large temperature dependence. Simulations of the temperature effect on the deformation were also conducted by a constitutive model previously proposed. The parameters used in the model can be determined simply from pure tension and cyclic tension-compression loading tests at several temperatures. It was also found that the constitutive model describes not only the temperature effect on the pure tension and the cyclic tension-compression loading but also the creep curves after cyclic tension-compression preloading.