The paper reports the preparation of W/Cu composite powders by a wet process based on the reduction of selected copper precursors in ethylene glycol and in the presence of tungsten powders. Reactions were performed in different conditions of temperature, time and concentration of the copper precursor. Two different Cu compounds, Cu(AcO)(2).H2O and CuO (coarse or fine) and two W powders (coarse or fine) were used. The reaction yields ranged from 75% to 98%. Dense bodies (up to 97% fractional density) with highly homogeneous microstructure as well as high electrical conductivity (up to 41% IACS) were obtained by sintering W/Cu powders at 1350 degreesC. (C) 2001 Kluwer Academic Publishers.