Robust metallic micropatterns fabricated on quartz glass surfaces by femtosecond laser-induced selective metallization

被引:8
作者
Huang, Yajun [1 ,2 ]
Xie, Xiaozhu [1 ,2 ,3 ]
Cui, Jiaqi [4 ]
Zhou, Wenqian [1 ,2 ]
Chen, Jianqiang [1 ,2 ]
Long, Jiangyou [1 ,2 ]
机构
[1] Guangdong Univ Technol, Sch Electromech Engn, Laser Micro Nano Proc Lab, Guangzhou 510006, Peoples R China
[2] Guangdong Univ Technol, Sch Electromech Engn, State Key Lab Precis Elect Mfg Technol & Equipmen, Guangzhou 51006, Peoples R China
[3] Guangdong Univ Technol, Dept Expt Teaching, Guangzhou 510006, Peoples R China
[4] Guangdong Univ Technol, Sch Phys & Optoelect Engn, Guangzhou 510006, Peoples R China
关键词
DEPOSITION; REDUCTION; DYNAMICS;
D O I
10.1364/OE.456927
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Quartz glass has a wide range of application and commercial value due to its high light transmittance and stable chemical and physical properties. However, due to the difference in the characteristics of the material itself, the adhesion between the metal micropattern and the glass material is limited. This is one of the main things that affect the application of glass surface metallization in the industry. In this paper, micropatterns on the surface of quartz glass are fabricated by a femtosecond laser-induced backside dry etching (fs-LIBDE) method to generate the layered composite structure and the simultaneous seed layer in a single-step. This is achieved by using fs-LIBDE technology with metal base materials (Stainless steel, Al, Cu, Zr-based amorphous alloys, and W) with different ablation thresholds, where atomically dispersed high threshold non-precious metals ions are gathered across the microgrooves. On account of the strong anchor effect caused by the layered composite structures and the solid catalytic effect that is down to the seed layer, copper micropatterns with high bonding strength and high quality, can be directly prepared in these areas through a chemical plating process. After 20-min of sonication in water, no peeling is observed under repeated 3M scotch tape tests and the surface was polished with sandpapers. The prepared copper micropatterns are 18 mu m wide and have a resistivity of 1.96 mu Omega.cm (1.67 mu Omega.cm for pure copper). These copper micropatterns with low resistivity has been proven to be used for the glass heating device and the transparent atomizing device, which could be potential options for various microsystems. (C) 2022 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement
引用
收藏
页码:19544 / 19556
页数:13
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