Effects of silver doping on electromigration of eutectic SnBi solder

被引：55

作者：

Chen, Chih-ming ^{[1
]}

Huang, Chih-chieh ^{[1
]}

机构：

[1] Natl Chung Hsing Univ, Dept Chem Engn, Taichung 402, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 461卷 / 1-2期

关键词：

electromigration; solder; Sn; Bi; Ag;

D O I：

10.1016/j.jallcom.2007.07.059

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Effects of silver doping on electromigration behavior of the eutectic SnBi solder are investigated. Electromigration can induce the Bi migration along with the direction of electron flow in the eutectic SnBi solder, thus Bi depletes at the cathode side but accumulates at the anode side. Plate-like Ag3Sn compound is formed as 0.5 wt% silver is doped into the solder. The Ag3Sn plates behave like roadblocks which can intercept the Bi migration from the cathode side to the anode side. Consequently, a great inconsistency is found between the Bi depletion at the cathode side and the Bi accumulation at the anode side. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：235 / 241

页数：7

共 17 条

[1]

BRANDENBURG S, 1998, P SURF MOUNT INT C E, P337

[2] Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing [J].

Chen, Chih-Ming ;

Huang, Chih-Chieh ;

Liao, Chien-Neng ;

Liou, Kuen-Ming .

JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (07) :760-765

[3] Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions [J].

Chen, CM ;

Chen, SW .

JOURNAL OF APPLIED PHYSICS, 2001, 90 (03) :1208-1214

[4] Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization [J].

Chen, LT ;

Chen, CM .

JOURNAL OF MATERIALS RESEARCH, 2006, 21 (04) :962-969

[5] Electromigration behavior of eutectic SnPb solder [J].

Choi, JY ;

Lee, SS ;

Joo, YC .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2002, 41 (12) :7487-7490

[6] Experimental equilibrium phase diagram of the Ag-Bi-Sn system [J].

Hassam, S ;

Dichi, E ;

Legendre, B .

JOURNAL OF ALLOYS AND COMPOUNDS, 1998, 268 (1-2) :199-206

[7] Electromigration failure in flip chip solder joints due to rapid dissolution of copper [J].

Hu, YC ;

Lin, YH ;

Kao, CR ;

Tu, KN .

JOURNAL OF MATERIALS RESEARCH, 2003, 18 (11) :2544-2548

[8] Eutectic Sn-Bi as an alternative to Pb-free solders [J].

Hua, F ;

Mei, ZQ ;

Glazer, J .

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, :277-283

[9] ON THE SN-BI-AG TERNARY PHASE-DIAGRAM [J].

KATTNER, UR ;

BOETTINGER, WJ .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :603-610

[10] Electromigration in Sn-Pb solder strips as a function of alloy composition [J].

Liu, CY ;

Chen, C ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2000, 88 (10) :5703-5709

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