Molecular Dynamic Simulation and Microstructure Analysis of Continuous Casting and Rolling CuAg Alloy Contact Wire from Yunnan Copper Industry Co. Ltd

被引：0

作者：

Zhou Xiaolong ^{[1
]}

Hong Zhenjun ^{[2
]}

Yang Jianjun ^{[2
]}

Li Gang

Yan Ming

He Jianhui

Chen Jingchao

Wu Yucai

Yang Yunchuan

机构：

[1] Kunming Univ Sci & Technol, Fac Mat Sci & Engn, Kunming 650093, Peoples R China

[2] Yunnan Copper Ind Co Ltd, Kunming 650102, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2011年 / 40卷

关键词：

continuous casting and rolling; CuAg alloy contact wire; molecular dynamic; microstructure; MECHANICAL-PROPERTIES; AG ALLOYS; CONDUCTIVITY; COMPOSITES;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

According to the component of CuAg alloy contact wire from Yunnan Copper Industry Co. Ltd., CuAg alloy model for molecular dynamic was built and CuAg alloy atomic law of motion was simulated at temperature of continuous rolling. The results show the silver cluster phenomenon does not appear in continuous casting and rolling CuAg alloy contact wire, which have silver 800-1000 mu g/g. It illustrated that silver will not form second phase precipitates in CuAg alloy. The results of SEM, TEM and HRTEM analysis also show that the silver is of completely solid solution state in Cu matrix after continuous casting and rolling process. The simulation results consist with experiment results. This solid solution state microstructure ensures stable properties of CuAg alloy contact wire.

引用

页码：286 / 289

页数：4

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