Hybrid microfabrication and 5-DOF levitation of micromachined electrostatically suspended gyroscope

被引：7

作者：

Cui, F. ^{[1
]}

Liu, W. ^{[1
]}

Chen, W. -Y. ^{[1
]}

Zhang, W. -P. ^{[1
]}

Wu, X. -S. ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Res Inst Micro Nano Sci & Technol, Natl Key Lab Nano Micro Fabricat Technol, Shanghai 200240, Peoples R China

来源：

ELECTRONICS LETTERS | 2011年 / 47卷 / 17期

基金：

中国国家自然科学基金;

关键词：

Surface micromachining - Microfabrication - Gyroscopes - Electrodes;

D O I：

10.1049/el.2011.1554

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A newly designed electrostatically suspended rotational microgyroscope, with optimised electrode structures and interconnections, is presented. Hybrid MEMS manufacturing techniques, including surface micromachining fabrication of thin film electrodes and interconnections, integration fabrication of thick nickel structures using UV-LIGA, DRIE of silicon rotor, microassembly and solder bonding, are employed to fabricate this device. Five-degree-of-freedom stable levitation control of the rotor, with fast initial levitation process and good time synchronisation at the null position for each axis, has been demonstrated.

引用

页码：976 / U57

页数：2

共 7 条

[1] Design and fabrication of an electrostatically suspended microgyroscope using UV-LIGA technology
Cui, Feng
Chen, Wenyuan
Zhang, Weiping
Xiao, Qijun
Ma, Gaoyin
Liu, Wu
[J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (12): : 1885 - 1896
[2] Design and fabrication of a micromachined electrostatically suspended gyroscope
Damrongsak, B.
Kraft, M.
Rajgopal, S.
Mehregany, M.
[J]. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, 2008, 222 (01) : 53 - 63
[3] Adaptive levitation control using single neuron for micromachined electrostatically suspended gyroscope
Ma, G. -Y.
Chen, W. -Y.
Cui, F.
Zhang, W. -P.
Wu, X. -Sh.
[J]. ELECTRONICS LETTERS, 2010, 46 (06) : 406 - U42
[4] Nakamura S, 2005, IEEE SENSOR, P939
[5] Low-temperature full wafer adhesive bonding
Niklaus, F
Enoksson, P
Kälvesten, E
Stemme, G
[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (02) : 100 - 107
[6] Qin Z, 2010, 5 IEEE INT C NAN MIC, P651
[7] Fuzzy tuning PI control for initial levitation of micromachined electrostatically levitated gyroscope
Xiao, Q. -J.
Li, S. -Y.
Chen, W. -Y.
Cui, F.
Zhang, W. -P.
[J]. ELECTRONICS LETTERS, 2009, 45 (16) : 818 - U23

← 1 →