Patent collateral, investor commitment, and the market for venture lending

被引:130
作者
Hochberg, Yael V. [1 ,2 ]
Serrano, Carlos J. [3 ,4 ]
Ziedonis, Rosemarie H. [2 ,5 ]
机构
[1] Rice Univ, Jones Sch Management, 6100 Main St,MS-531, Houston, TX 77005 USA
[2] Natl Bur Econ Res, Cambridge, MA 02138 USA
[3] Univ Pompeu Fabra, Dept Econ & Business, Carrer Ramon Trias Fargas 25-27, Barcelona 08005, Spain
[4] Barcelona Grad Sch Econ, Carrer Ramon Trias Fargas 25-27, Barcelona 08005, Spain
[5] Boston Univ, Questrom Sch Business, 595 Commonwealth Ave, Boston, MA 02215 USA
关键词
Venture debt; Venture capital; Collateral assets; Patents; LIQUIDATION VALUES; DEBT; PROPAGATION; GROWTH; CREDIT; FIRMS; RISK;
D O I
10.1016/j.jfineco.2018.06.003
中图分类号
F8 [财政、金融];
学科分类号
0202 ;
摘要
We explore the market for lending to start-ups and two mechanisms that facilitate trade within it: (1) the salability of patent collateral and (2) the credible commitment of equity investors. Intensified trading in the secondary patent market is strongly related to lending, particularly for start-ups with more redeployable patent assets. Utilizing the crash of 2000 as a severe and unexpected capital supply shock for venture capitalists, we further show that lenders continue to finance start-ups with recently funded investors better able to credibly commit to refinance their portfolio companies while withdrawing from otherwise promising projects that could have needed their funds the most. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:74 / 94
页数:21
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