Hybrid and monolithic infrared detector arrays

被引：0

作者：

Van Hoof, C ^{[1
]}

Zimmermann, L ^{[1
]}

John, J ^{[1
]}

De Moor, P ^{[1
]}

Kavadias, S ^{[1
]}

Gastal, M ^{[1
]}

Németh, S ^{[1
]}

Borghs, G ^{[1
]}

Merken, P ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

FIFTH INTERNATIONAL CONFERENCE ON MATERIAL SCIENCE AND MATERIAL PROPERTIES FOR INFRARED OPTOELECTRONICS | 2001年 / 4355卷

关键词：

IR detection; hybrid integration; uncooled bolometers; surface micromachining; hermetic packaging;

D O I：

10.1117/12.417784

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Infrared detector arrays can be divided in two distinct classes: hybrid (and typically photon) detectors and monolithic (and generally thermal) detectors. Hybrid detectors involve flip-chip integration of the detector array and the readout chip, require cooling and thus cause substantial system cost. Monolithic detectors do not suffer this system overhead and most notably the microbolometer thermal detectors allow ambient operating temperature. IMEC focuses on III-V (InGaAs, InAs and InAsSb) short-wave and mid-infrared detector arrays for hybrid integration on one side and surface-micromachined uncooled polySiGe microbolometer arrays on the other hand. Progress in both types of detector systems is reported.

引用

页码：23 / 31

页数：3

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