Thermal Stability and Mechanical Response of Bi2Te3-Based Materials for Thermoelectric Applications

被引:65
作者
Zheng, Yun [1 ]
Tan, Xian Yi [2 ]
Wan, Xiaojuan [1 ]
Cheng, Xin [1 ]
Liu, Zhihong [1 ]
Yan, Qingyu [2 ]
机构
[1] Jianghan Univ, Minist Educ, Key Lab Optoelect Chem Mat & Devices, Wuhan 430056, Peoples R China
[2] Nanyang Technol Univ, Sch Mat Sci & Engn, 50 Nanyang Ave, Singapore 639798, Singapore
基金
中国国家自然科学基金;
关键词
thermal stability; mechanical properties; fatigue; Bi2Te3-based; thermoelectric; BIAXIAL FRACTURE STRENGTH; GRAIN-SIZE DEPENDENCE; TRANSPORT-PROPERTIES; POWER-GENERATION; PERFORMANCE; TELLURIDE; TEMPERATURE; LAST; HARDNESS; ALLOYS;
D O I
10.1021/acsaem.9b02093
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Bi2Te3-based materials are among the most mature thermoelectric materials and have found wide near-room-temperature applications in power generation and spot cooling. Their practical applications often involve complicated service conditions, such as prolonged and large temperature gradients, clamping forces, and vibrational stresses. Thus, it is important to investigate the thermal stability and mechanical response of Bi2Te3-based materials. In this review, we summarize the recent advances in the service performances of Bi2Te3-based materials. The thermal stabilities of both n- and p-type Bi2Te3-based materials are discussed when exposed to repetitive thermal loading, or fixed operational temperatures in vacuum or ambient atmosphere. Then, the mechanical responses of Bi2Te3-based materials are overviewed, including the quasi-static mechanical strength, compressive fatigue, and creep behavior. Lastly, the current concerns and future development of Bi2Te3-based materials are outlined.
引用
收藏
页码:2078 / 2089
页数:12
相关论文
共 108 条
  • [81] Thermoelectric and thermomechanical properties of the hot pressed polycrystalline Bi0.5S1.5Te3 alloys
    Shen, J. J.
    Zhang, S. N.
    Yang, S. H.
    Yin, Z. Z.
    Zhu, T. J.
    Zhao, X. B.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 509 (01) : 161 - 164
  • [82] Recent advances in high-performance bulk thermoelectric materials
    Shi, X.
    Chen, L.
    Uher, C.
    [J]. INTERNATIONAL MATERIALS REVIEWS, 2016, 61 (06) : 379 - 415
  • [83] Mg3+δSbxBi2-x Family: A Promising Substitute for the State-of-the-Art n-Type Thermoelectric Materials near Room Temperature
    Shu, Rui
    Zhou, Yecheng
    Wang, Qi
    Han, Zhijia
    Zhu, Yongbin
    Liu, Yong
    Chen, Yuexing
    Gu, Meng
    Xu, Wei
    Wang, Yu
    Zhang, Wenqing
    Huang, Li
    Liu, Weishu
    [J]. ADVANCED FUNCTIONAL MATERIALS, 2019, 29 (04)
  • [84] Multi-Scale Microstructural Thermoelectric Materials: Transport Behavior, Non-Equilibrium Preparation, and Applications
    Su, Xianli
    Wei, Ping
    Li, Han
    Liu, Wei
    Yan, Yonggao
    Li, Peng
    Su, Chuqi
    Xie, Changjun
    Zhao, Wenyu
    Zhai, Pengcheng
    Zhang, Qingjie
    Tang, Xinfeng
    Uher, Ctirad
    [J]. ADVANCED MATERIALS, 2017, 29 (20)
  • [85] Synergistically Optimized Thermoelectric Performance in Bi0.48Sb1.52Te3 by Hot Deformation and Cu Doping
    Tan, Chang
    Tan, Xiaojian
    Yu, Bo
    Liu, Guo-Qpng
    Wang, Hongxiang
    Luo, Guoqiang
    Xu, Jingtao
    Wu, Qngsong
    Liang, Bo
    Jiang, Jun
    [J]. ACS APPLIED ENERGY MATERIALS, 2019, 2 (09): : 6714 - 6719
  • [86] Thermoelectric power generation: from new materials to devices
    Tan, Gangjian
    Ohta, Michihiro
    Kanatzidis, Mercouri G.
    [J]. PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2019, 377 (2152):
  • [87] Finite Element Thermomechanical Modeling of Large Area Thermoelectric Generators based on Bismuth Telluride Alloys
    Turenne, S.
    Clin, Th
    Vasilevskiy, D.
    Masut, R. A.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (09) : 1926 - 1933
  • [88] Transient interlaminar thermal stress in multi-layered thermoelectric materials
    Wang, B. L.
    Cui, Y. J.
    [J]. APPLIED THERMAL ENGINEERING, 2017, 119 : 207 - 214
  • [89] Analysis of inclusion in thermoelectric materials: The thermal stress field and the effect of inclusion on thermoelectric properties
    Wang, P.
    Wang, B. L.
    Wang, K. F.
    Cui, Y. J.
    [J]. COMPOSITES PART B-ENGINEERING, 2019, 166 : 130 - 138
  • [90] Effect of annealing on microstructure and thermoelectric properties of hot-extruded Bi-Sb-Te bulk materials
    Wang, Zhi-Lei
    Araki, Takehiro
    Onda, Tetsuhiko
    Chen, Zhong-Chun
    [J]. JOURNAL OF MATERIALS SCIENCE, 2018, 53 (12) : 9117 - 9130