Numerical Analysis for Thermal Field of Susceptor in MOCVD Reactor

被引:0
|
作者
Ho, Kuo-Hung [1 ]
Hu, Chih-Kai [1 ]
Li, Tomi T. [1 ]
机构
[1] Natl Cent Univ, Dept Mech Engn, Taoyuan, Taiwan
来源
2015 China Semiconductor Technology International Conference | 2015年
关键词
MOCVD; SiC susceptor; temperature uniformity;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A MOCVD process requires not only high heating efficiency, but also good temperature uniformity on susceptor surface. The most common material of susceptor is graphite, but the heating lifetime is very short. Instead, this work uses the SiC as susceptor material. It enhances both the lifetime and thermal conductivity. In the meantime, we also change the shape and structure of susceptor to improve the temperature uniformity on the surface. In addition, the gas flow rate and wall temperature will affect the temperature uniformity thus the analysis of thermal flow field is also included. By using above methods, the temperature uniformity of susceptor can improve about 45%.
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页数:3
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