Electrical and thermal behavior of polypropylene filled with copper particles

被引：230
|
作者：
Boudenne, A
Ibos, L
Fois, M
Majesté, JC
Géhin, E
机构：
[1] Univ Paris 12, Ctr Etud & Rech Therm, F-94010 Creteil, France
[2] Univ St Etienne, UMR 5156, Lab Rheol Mat Plast, F-42023 St Etienne, France
来源：
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING | 2005年 / 36卷 / 11期
关键词：
thermal properties; electrical conductivity;
D O I：
10.1016/j.compositesa.2005.02.005
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Thermal conductivity, diffusivity, effusivity and specific heat of polypropylene matrix filled with copper particles of two different sizes were investigated. A parallel study of the evolution of the electrical conductivity was also carried out. The highest heat transport ability was observed for the composites filled with the smaller particles. Electrical conductivity investigations showed that the size of fillers also influences the percolation threshold. The Agari's model provides a good estimation of the thermal conductivity of composites for all filler concentrations. It was used in order to give a comparative analysis of both electrical and thermal properties of such two-phase systems. Nevertheless, the physical meaning of the two fitting parameters C-1 and C-2 of Agari's model has to be completed. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1545 / 1554
页数：10
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