In-situ investigation of lead-free solder alloy formation using a hot-plate microscope

被引:1
作者
Bergmann, Rene [1 ]
Tang, Peter Torbert [2 ]
Hansen, Hans Norgaard [1 ]
Moller, Per [1 ]
机构
[1] Tech Univ Denmark, Dept Mfg Engn & Management IPL, Bldg 427S,2800 Kgs, DK-2800 Lyngby, Denmark
[2] IPU Mfg, Produktionstorvet, DK-2800 Lyngby, Denmark
来源
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2007年
关键词
D O I
10.1109/EPTC.2007.4469822
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead-free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.
引用
收藏
页码:252 / +
页数:2
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