Multilayer power delivery network design for high-speed microprocessor system

被引：0

作者：

Park, SG ^{[1
]}

Kim, J ^{[1
]}

Yook, JG ^{[1
]}

Park, HK ^{[1
]}

机构：

[1] Yonsei Univ, Dept Elect & Elect Engn, Seoul 120749, South Korea

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, an efficient modeling method for arbitrary shaped multi-layer power distribution network is proposed based on the method of transmission line grid model. In addition, a pre-layout design approach for the high-speed microprocessor is proposed. For arbitrary-shaped multi-layer PCB stack up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system.

引用

页码：1613 / 1618

页数：6

共 10 条

[1]

GOLDFARB ME, 1991, IEEE MICROW GUIDED W, V1, P135, DOI DOI 10.1109/75.91090

[2]

*INT CORP, 2001, INT PENT 4 PROC INT

[3] MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES [J].

LEE, K ;

BARBER, A .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04) :628-639

[4] EFFICIENT MODELING OF POWER PLANES IN COMPUTER PACKAGES USING THE FINITE-DIFFERENCE TIME-DOMAIN METHOD [J].

MITTRA, R ;

CHEBOLU, S ;

BECKER, WD .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1994, 42 (09) :1791-1795

[5] Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination [J].

Novak, I .

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1998, :181-184

[6]

NOVAK I, 2000, DESIGNCON 00

[7]

ROY T, 1998, IEEE TOP M EL PERF E

[8] Power distribution system design methodology and capacitor selection for modern CMOS technology [J].

Smith, LD ;

Anderson, RE ;

Forehand, DW ;

Pelc, TJ ;

Roy, T .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (03) :284-291

[9] Computation of switching noise in printed circuit boards [J].

Yook, JG ;

Chandramouli, V ;

Katehi, LPB ;

Sakallah, KA ;

Arabi, TR ;

Schreyer, TA .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (01) :64-75

[10]

YOOK JG, 1997, IEEE T MICROWAVE THE, V45

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