Heat transfer in microchannel devices using DSMC

被引：72

作者：

Liou, WW ^{[1
]}

Fang, YC ^{[1
]}

机构：

[1] Western Michigan Univ, Dept Mech & Aerosp Engn, Kalamazoo, MI 49008 USA

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2001年 / 10卷 / 02期

关键词：

direct simulation Monte Carlo (DSMC); Knudsen number; wall heat flux;

D O I：

10.1109/84.925780

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The heat transfer characteristics of supersonic flows in microchannels is studied using direct simulation Monte Carlo (DSMC) [1] method. The velocity components and the spatial coordinates of the simulated particles are calculated and recorded by using a variable-hard-sphere (VHS) [2] collision model, The effects of Knudsen number (Kn) on the heat transfer of the microchannel flows are examined. The results show that the magnitude of the temperature jump at the wall increases with increasing Kn, The heat transfer to the isothermal wall is found to increase significantly with Kn, The possible causes for the increase of wall heat transfer are discussed.

引用

页码：274 / 279

页数：6

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