Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies

被引：0

作者：

Selim, Ramsey ^{[1
]}

Hoofman, Romano ^{[2
]}

Labie, Riet ^{[2
]}

Sandeep, Veda ^{[1
]}

Drischel, Thomas ^{[3
]}

Torki, Kholdoun ^{[4
]}

机构：

[1] Tyndal Natl Insitute, Cork, Ireland

[2] IMEC, Leuven, Belgium

[3] Fraunhofer IIS, Erlangen, Germany

[4] CMP, Grenoble, France

来源：

2021 SMART SYSTEMS INTEGRATION (SSI) | 2021年

基金：

欧盟地平线“2020”;

关键词：

system integration; 2.5/3D integration; photonics packaging; MEMS; microfluidics; MPW runs; cost sharing;

D O I：

10.1109/SSI52265.2021.94669704

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

This paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including co-packaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need true advanced packaging and system integration to realize their complex multi-technology devices. This is done by means of a virtual demonstrator that include both 2.5D/3D assemblies of ASICs and integrated photonic devices, as well as MEMS and microfluidics devices. It also addresses lowering the cost barrier for users accessing these technologies for their products, such that it will enable an increased uptake of system integration by the industry at large.

引用

页数：4

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