A novel buried oxide isolation for monolithic RF inductors on silicon

被引:23
作者
Erzgräber, HB [1 ]
Grabolla, T [1 ]
Richter, HH [1 ]
Schley, P [1 ]
Wolff, A [1 ]
机构
[1] Inst Semicond Phys, D-15230 Frankfurt, Germany
来源
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST | 1998年
关键词
D O I
10.1109/IEDM.1998.746415
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a new approach to realizing high quality factor (Q) inductors using CMOS-compatible process steps only. The method is based on the preparation of very thick, buried oxide regions beneath the inductors to reduce parasitics. The behavior of inductors fabricated with a CMOS compatible, 3-level metal silicon technology conforms well with simulations.
引用
收藏
页码:535 / 539
页数:5
相关论文
共 7 条
[1]   Integrated RF and microwave components in BiCMOS technology [J].
Burghartz, JN ;
Soyuer, M ;
Jenkins, KA .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (09) :1559-1570
[2]   Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates [J].
Burghartz, JN ;
Edelstein, DC ;
Jenkins, KA ;
Jahnes, C ;
Uzoh, C ;
OSullivan, EJ ;
Chan, KK ;
Soyuer, M ;
Roper, P ;
Cordes, S .
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, :99-102
[3]  
BURGHARTZ JN, 1997, P EUR SOL STAT DEV R, P143
[4]   Spiral and solenoidal inductor structures on silicon using Cu-Damascene interconnects [J].
Edelstein, DC ;
Burghartz, JN .
PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 1998, :18-20
[5]  
Park M, 1997, INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, P59
[6]   A physical model for planar spiral inductors on silicon [J].
Yue, CP ;
Ryu, CS ;
Lau, J ;
Lee, TH ;
Wong, SS .
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, :155-158
[7]   On-chip spiral inductors with patterned ground shields for Si-based RF IC's [J].
Yue, CP ;
Wong, SS .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1998, 33 (05) :743-752