FAST PULSED HEATING AND IMPACT COOLING OF THERMAL MICROACTUATORS

被引：0

作者：

Pandey, S. S. ^{[1
]}

Banerjee, A. ^{[1
]}

Hasan, N. ^{[1
]}

Banerjee, N. ^{[1
]}

Mastrangelo, C. H. ^{[1
]}

机构：

[1] Univ Utah, Dept Elect & Comp Engn, Salt Lake City, UT USA

来源：

2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年

关键词：

Microelectromechanical systems; Microfabrication Microactuators; ELECTROTHERMAL ACTUATORS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports techniques to rapidly heat and cool thermal actuators in microseconds. Rapid temperature changes can lead to high-speed motion and many-fold improvement in load power delivery compared to that achievable with conventional thermal microactuator devices. Rapid heating is achieved by capacitor discharge across the heated element. Rapid cooling is achieved by impacting thin cold plungers that remove heat from hot actuator beams by ultrafast diffusion. We have fabricated and preliminary tested polysilicon thermal actuators based on these principles.

引用

页码：908 / 911

页数：4