We survey the current state of the model antiferroelectric PbZrO3 (PZO) material. The present paper may be seen as a short and non-exhaustive review of the main properties of this typical antiferroelectric system with perovskite structure. By focusing on this simple antiferroelectric material, our goal is to stress the interest of studying antiferroelectrics in general from both fundamental and technological points of view. We address the effect of doping, some properties of solid solutions, strain and stress effects and nanoscaling consequences.
机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Leilei Qiao
Cheng Song
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Cheng Song
Yiming Sun
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Yiming Sun
Muhammad Umer Fayaz
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Muhammad Umer Fayaz
Tianqi Lu
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Tianqi Lu
Siqi Yin
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Siqi Yin
Chong Chen
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Chong Chen
Huiping Xu
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Huiping Xu
Tian-Ling Ren
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)
Tian-Ling Ren
Feng Pan
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机构:Tsinghua University,Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Beijing Innovation Center for Future Chip (ICFC)