Steady state finite element analysis of a double stack cold plate with heat losses

被引:6
作者
Quadir, GA [1 ]
Beh, SL [1 ]
Seetharamu, KN [1 ]
Hassan, AY [1 ]
机构
[1] Univ Sci Malaysia, Sch Mech Engn, Nibong Tebal, Penang, Malaysia
关键词
Steady State; Finite Element Analysis; Governing Equation; Heat Loss; Dimensionless Parameter;
D O I
10.1007/s00231-002-0342-7
中图分类号
O414.1 [热力学];
学科分类号
摘要
A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted residual method is employed to obtain the finite element formulation of the governing equation. A simple one-dimensional fin theory is applied to the discretised elements during the analysis. The analysis is divided into two parts: a single unit cell analysis and the analysis of the assembly of several number of unit cells. Results from the present analysis with a single unit cell for double stack cold plate without heat losses, compare well with those available in the literature. The analyses of the assembly of unit cells with heat losses from the top and bottom surfaces of the stack show that the single unit cell can be considered to be the representative of the stack only when there is no heat loss.
引用
收藏
页码:519 / 528
页数:10
相关论文
共 11 条
[1]  
Kern D., 1972, EXTENDED SURFACE HEA
[2]   EFFICIENT ALGORITHM FOR EVALUATING ARRAYS OF EXTENDED SURFACE [J].
KRAUS, AD ;
SNIDER, AD ;
DOTY, LF .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1978, 100 (02) :288-293
[3]  
KRAUS AD, 1995, ADV ELECT PACKAGING, P871
[4]  
KRAUS AD, 1962, P NAT AER EL C, P78
[5]  
KRAUS AD, 1961, P NAT AER EL C, P381
[6]  
Lewis R.W., 1996, The finite element method in heat transfer analysis
[7]  
MIKHAILOV MD, 1981, HEAT EXCHANGERS THER
[8]  
Pieper R. J., 1995, Advances in Electronic Packaging 1995. Proceedings of the International Electronic Packaging Conference - INTERpack '95, P865
[9]   Performance analysis of double stack cold plates covering all conditions of asymmetric heat loading [J].
Pieper, RJ ;
Kraus, AD .
JOURNAL OF ELECTRONIC PACKAGING, 1998, 120 (03) :296-301
[10]  
Segerlind LJ., 1991, APPL FINITE ELEMENT