Issues and Key Technologies for Next Generation 3D NAND

被引：4
|
作者：
Yoon, Chi-Weon [1 ]
Kim, Hyung-Gon [1 ]
Lee, Seon-Kyoo [1 ]
Lee, Jinyub [1 ]
Song, Jai Hyuk [1 ]
机构：
[1] Samsung Elect Co LtD, Dept Flash Prod & Technol, Hwasung, South Korea
来源：
2021 INTERNATIONAL CONFERENCE ON ELECTRONICS, INFORMATION, AND COMMUNICATION (ICEIC) | 2021年
关键词：
3D VNAND; WL Stacks; Cell to Cell Interference; TLC; QLC; Toggle; 4.0/5.0; Frequency Boosting Interface (F-chip);
D O I：
10.1109/ICEIC51217.2021.9369795
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
In this paper, design challenges and key technologies to overcome the hurdles for the future 3D NAND are introduced. More specifically, state-of-the-art solutions for higher density, lower cost and higher bandwidth NAND is covered in detail.
引用
收藏
页数：4
相关论文
共 50 条
  • [1] 3D NAND Scaling in the next decade
    Meyer, Russ
    Fukuzumi, Yoshiaki
    Dong, Yingda
    2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM, 2022,
  • [2] Overview of 3D NAND Technologies and Outlook
    Venkatesan, Srinath
    Aoulaiche, Marc
    2018 NON-VOLATILE MEMORY TECHNOLOGY SYMPOSIUM (NVMTS 2018), 2018,
  • [3] The Next Generation EDA System for 3D Printing Technologies
    Kariya, Kazuhiro
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 3 - 4
  • [4] Recent Progress on 3D NAND Flash Technologies
    Goda, Akira
    ELECTRONICS, 2021, 10 (24)
  • [5] Proposal of P-Channel FE NAND with High Drain Current and Feasible Disturbance for Next Generation 3D NAND
    Kuk, Song-Hyeon
    Han, Jae-Hoon
    Kim, Bong Ho
    Kim, Junpyo
    Kim, Sang-Hyeon
    2023 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW, 2023, : 117 - 120
  • [6] Cell Operation Technologies to Overcome Scale-down Issues in 3D NAND Flash Memory
    Kim, Wandong
    Byeon, DaeSeok
    Joe, Sung-Min
    Lee, Jinyub
    Song, Jai Hyuk
    2022 INTERNATIONAL CONFERENCE ON ELECTRONICS, INFORMATION, AND COMMUNICATION (ICEIC), 2022,
  • [7] Error Generation for 3D NAND Flash Memory
    Liu, Weihua
    Wu, Fei
    Meng, Songmiao
    Chen, Xiang
    Xie, Changsheng
    PROCEEDINGS OF THE 2022 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2022), 2022, : 56 - 59
  • [8] Reliability of key technologies in 3D integration
    Ko, Cheng-Ta
    Chen, Kuan-Neng
    MICROELECTRONICS RELIABILITY, 2013, 53 (01) : 7 - 16
  • [9] Architecture and Process Integration Overview of 3D NAND Flash Technologies
    Lee, Geun Ho
    Hwang, Sungmin
    Yu, Junsu
    Kim, Hyungjin
    APPLIED SCIENCES-BASEL, 2021, 11 (15):
  • [10] An overview of key technologies for the next generation networks
    Green, H
    Ghiggino, P
    OPTICAL NETWORKS AND TECHNOLOGIES, 2005, 164 : 31 - 43
12345