Characterization of the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films using combinatorial deposition and micro-cantilevers

被引：15

作者：

Sasangka, Wardhana A. ^{[1
,2
]}

Gan, Chee Lip ^{[1
,2
]}

Lai, Donny ^{[3
]}

Tan, Chuan Seng ^{[3
]}

Thompson, Carl V. ^{[2
,4
]}

机构：

[1] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[2] Singapore MIT Alliance, Adv Mat Micro & Nanosyst, Singapore 117576, Singapore

[3] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore

[4] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2015年 / 25卷 / 03期

关键词：

Young's modulus; residual stress; fracture strength; intermetallic compound; micro-cantilevers; MECHANICAL-PROPERTIES; DEFLECTION; GROWTH;

D O I：

10.1088/0960-1317/25/3/035023

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microcantilevers coupled with combinatorial deposition were used to characterize the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films over a broad range of compositions. Measurement inaccuracies due to cantilever non-idealities were corrected using finite element simulations and deflection measurements at multiple locations. eta-phase with a composition Cu53Sn25In22 was discovered to have the highest fracture strength and therefore has potential in thin film solder bonding applications. This study provides a database for the mechanical properties of a wide range of Cu-Sn-In alloys. Moreover, the techniques developed in this study provide a highly efficient approach to finding an intermetallic compound composition with the most desired mechanical properties.

引用

页数：14

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