Characterization of the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films using combinatorial deposition and micro-cantilevers

被引：15
|
作者：
Sasangka, Wardhana A. [1 ,2 ]
Gan, Chee Lip [1 ,2 ]
Lai, Donny [3 ]
Tan, Chuan Seng [3 ]
Thompson, Carl V. [2 ,4 ]
机构：
[1] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore
[2] Singapore MIT Alliance, Adv Mat Micro & Nanosyst, Singapore 117576, Singapore
[3] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
[4] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2015年 / 25卷 / 03期
关键词：
Young's modulus; residual stress; fracture strength; intermetallic compound; micro-cantilevers; MECHANICAL-PROPERTIES; DEFLECTION; GROWTH;
D O I：
10.1088/0960-1317/25/3/035023
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Microcantilevers coupled with combinatorial deposition were used to characterize the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films over a broad range of compositions. Measurement inaccuracies due to cantilever non-idealities were corrected using finite element simulations and deflection measurements at multiple locations. eta-phase with a composition Cu53Sn25In22 was discovered to have the highest fracture strength and therefore has potential in thin film solder bonding applications. This study provides a database for the mechanical properties of a wide range of Cu-Sn-In alloys. Moreover, the techniques developed in this study provide a highly efficient approach to finding an intermetallic compound composition with the most desired mechanical properties.
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页数：14
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