Study on the reaction rate and mechanism of Ni-P electroless plating

被引:3
|
作者
Zhang, GD [1 ]
机构
[1] E China Inst Met, Dept Chem Engn, Maanshan 243002, Peoples R China
关键词
Ni-P electroless plating; mixed potential theory; reaction mechanism;
D O I
10.3866/PKU.WHXB19980509
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The deposition rate of Ni-P electroless coating and the decomposition rate of H2PO2- were studied by analyzing the mass and the P content of the electeroless coating, and by measuring the volume of the evolved hydrogen. Based on the mixed potential theory, electroless plating current, which can be expressed by the reaction rate, was obtained by analyzing the polarzation curves of Ni-P in solutions of various composition. The reaction is consistant with the one electron transfer mechanism. The influence of the solution pH on electeoless plating rate and electroless plating: effeciency was explained.
引用
收藏
页码:429 / 434
页数:6
相关论文
共 9 条
  • [1] ELECTROCHEMICAL INVESTIGATION OF THE AUTOCATALYTIC DEPOSITION OF NI-CU-P ALLOYS
    CHASSAING, E
    CHERKAOUI, M
    SRHIRI, A
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1993, 23 (11) : 1169 - 1174
  • [2] HUHY A, 1990, PLAT SURF FINISH, V77, P3
  • [3] ISHILRASHI, 1968, ELECTROLESS, P10
  • [4] LULS RM, 1964, PLATING, V51, P69
  • [5] ANODIC-OXIDATION OF REDUCTANTS IN ELECTROLESS PLATING
    OHNO, I
    WAKABAYASHI, O
    HARUYAMA, S
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (10) : 2323 - 2330
  • [6] Paunovic M., 1968, PLATING, V55, P1161
  • [7] TOUHAMI M, 1995, J APPL ELECTROCHEM, V25, P487
  • [8] Watanabe T., 1989, J SURF FINISH SOC JP, V40, P425
  • [9] ON THE MECHANISM OF ELECTROLESS COPPER DEPOSITION
    WIESE, H
    WEIL, KG
    [J]. BERICHTE DER BUNSEN-GESELLSCHAFT-PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 1987, 91 (06): : 619 - 626