Novel micro-patterning processes for thin film NiTi vascular devices

In order to create microscale features in thin film NiTi for use in vascular endografts, a novel 'lift-off process' was developed for use with deep reactive ion etching. A wet etching approach is compared to two variations of this new 'lift-off' process. The first lift-off process (lift-off I) used Si posts to define the features of NiTi film deposited on the Si substrate. This method produced fractures in the NiTi when the film was released. The lift-off II process used Si islands as substrate for the film while the Si wafer defined the specific geometric features. Lift-off II process allowed for the creation of various shape patterns (i.e., ellipse, diamond, circle, square, etc) in the range of 5-180 mu m. The lift-off II process produced smooth and well aligned micro-patterns in thin film NiTi without the undercutting found in wet etching techniques. The micro-patterned thin film NiTi formed from the lift-off II process was used to cover a stent. In vivo tests were performed to evaluate the endothelialization though patterned thin films. Angiography, histopathology and SEM showed patency of the artery and uniformly promoted endothelial layer covering without thrombosis in both a medium and small artery.