Tungsten/copper composite deposits produced by a cold spray

被引：124

作者：

Kang, HK ^{[1
]}

Kang, SB ^{[1
]}

机构：

[1] Korea Inst Machinery & Mat, Non Ferrous Grp, Chang Won 641010, South Korea

来源：

SCRIPTA MATERIALIA | 2003年 / 49卷 / 12期

关键词：

tungsten/copper composite; cold-spray; electronic package application; COATINGS;

D O I：

10.1016/j.scriptamat.2003.08.023

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

An agglomerated tungsten/copper composite powder was both cold sprayed and plasma sprayed onto a mild steel substrate for electronic package applications. Most pores resulting from the spraying were found in the vicinity of the tungsten-rich regions of the final product, The levels of porosity varied with the amount of tungsten present. No copper oxidation was found at the cold-sprayed deposit, but relatively high copper oxidation was observed at the plasma-sprayed deposit. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1169 / 1174

页数：6

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