Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader

被引：20

作者：

Wang, Y. ^{[1
]}

Ding, G. -F. ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Inst Micro & Nano Sci & Technol, Shanghai 200030, Peoples R China

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2008年 / 14卷 / 03期

关键词：

Heat Transfer; Thermal Boundary Layer; Heat Transfer Characteristic; Heat Transfer Performance; Heat Transfer Efficiency;

D O I：

10.1007/s00542-007-0455-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A manifold microchannel heat sink integrated with a high efficient copper heat spreader is presented. A series analysis of three-dimensional fluid flow and heat transfer performance in this microchannel heat sink and conventional structure are performed by CFX commercial software package. The temperature difference along the flow direction in the new microchannel heat sink is less than that of the conventional microchannel heat sink due to effect of the transverse channel arrays. The maximum heat flux input of the new microchannel heat sink increases 75% more than the conventional structure with the flow rate of 1 m/s. The new design has better heat transfer characteristics than conventional one for the full range of flow rates considered.

引用

页码：389 / 395

页数：7

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