Direct writing laser of high aspect ratio epoxy microstructures

被引：21
作者：
Cadarso, V. J. [1 ]
Pfeiffer, K. [2 ]
Ostrzinski, U. [2 ]
Bureau, J. B. [3 ]
Racine, G. A. [3 ]
Voigt, A. [2 ]
Gruetzner, G. [2 ]
Brugger, J. [1 ]
机构：
[1] Ecole Polytech Fed Lausanne, Microsyst Lab LMIS1, Lausanne, Switzerland
[2] Micro Resist Technol GmbH, Berlin, Germany
[3] Ecole Polytech Fed Lausanne, Ctr Micronanotechnol CMI, CH-1015 Lausanne, Switzerland
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期
关键词：
MEMS; SU-8; RESIST; ACCELEROMETERS; PHOTORESIST; FABRICATION;
D O I：
10.1088/0960-1317/21/1/017003
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.
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收藏
页数：6
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