Direct writing laser of high aspect ratio epoxy microstructures

被引：21

作者：

Cadarso, V. J. ^{[1
]}

Pfeiffer, K. ^{[2
]}

Ostrzinski, U. ^{[2
]}

Bureau, J. B. ^{[3
]}

Racine, G. A. ^{[3
]}

Voigt, A. ^{[2
]}

Gruetzner, G. ^{[2
]}

Brugger, J. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, Microsyst Lab LMIS1, Lausanne, Switzerland

[2] Micro Resist Technol GmbH, Berlin, Germany

[3] Ecole Polytech Fed Lausanne, Ctr Micronanotechnol CMI, CH-1015 Lausanne, Switzerland

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期

关键词：

MEMS; SU-8; RESIST; ACCELEROMETERS; PHOTORESIST; FABRICATION;

D O I：

10.1088/0960-1317/21/1/017003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.

引用

页数：6

共 50 条

[31] Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates
Lau, Kia Hian
Giridhar, Archit
Harikrishnan, Sekar
Satyanarayana, Nalam
Sinha, Sujeet K.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (11): : 1863 - 1871
[32] Direct Writing of Semiconducting and Conducting Microstructures by Using Selective Laser Sintering and Reduction of CuO Nanoparticles
Li, Qian-Hua
Zou, Rong
Yu, Qian-Lin
Xu, Guo-Juan
Li, Xiao-Jie
He, Ying-Zhi
Xu, Shi-Tong
Ma, Ren-De
Cao, Hong-Zhong
ACS APPLIED NANO MATERIALS, 2024, 7 (11) : 12682 - 12690
[33] Ultrafast laser direct drilling of high aspect ratio microchannels in fused silica: Insights on channel self-termination mechanisms
Jia, Xiao
Zhao, Xin
OPTICS AND LASER TECHNOLOGY, 2023, 157
[34] Multi-scale laser direct writing of conductive metal microstructures using a 405-nm blue laser
Komori, Takuma
Furukawa, Taichi
Iijima, Motoyuki
Maruo, Shoji
OPTICS EXPRESS, 2020, 28 (06) : 8363 - 8370
[35] Printing direction dependent microstructures in direct ink writing
Friedrich, Leanne
Begley, Matthew
ADDITIVE MANUFACTURING, 2020, 34
[36] Hot punching of high-aspect-ratio 3D polymeric microstructures for drug delivery
Petersen, Ritika S.
Keller, Stephan S.
Boisen, Anja
LAB ON A CHIP, 2015, 15 (12) : 2576 - 2579
[37] Arrays of high aspect ratio magnetic microstructures for large trapping throughput in lab-on-chip systems
Mekkaoui, Samir
Le Roy, Damien
Audry, Marie-Charlotte
Lachambre, Joel
Dupuis, Veronique
Desgouttes, Jerome
Deman, Anne-Laure
MICROFLUIDICS AND NANOFLUIDICS, 2018, 22 (10)
[38] High aspect ratio submicron microstructures in LiNbO3:: fabrication and potential applications to photonic devices
Yin, SZ
PHOTONIC DEVICES AND ALGORITHMS FOR COMPUTING, 1999, 3805 : 40 - 43
[39] Inkjet Printing of High Aspect Ratio Superparamagnetic SU-8 Microstructures with Preferential Magnetic Directions
Jacot-Descombes, Loic
Gullo, Maurizio R.
Cadarso, Victor J.
Mastrangeli, Massimo
Ergeneman, Olgac
Peters, Christian
Fatio, Philipe
Freidy, Mouhamad A.
Hierold, Christofer
Nelson, Bradley J.
Brugger, Juergen
MICROMACHINES, 2014, 5 (03): : 583 - 593
[40] From photoinduced electron transfer to 3D metal microstructures via direct laser writing
Waller, Erik Hagen
von Freymann, Georg
NANOPHOTONICS, 2018, 7 (07) : 1259 - 1277

← 1 2 3 4 5 →