Direct writing laser of high aspect ratio epoxy microstructures

被引：21

作者：

Cadarso, V. J. ^{[1
]}

Pfeiffer, K. ^{[2
]}

Ostrzinski, U. ^{[2
]}

Bureau, J. B. ^{[3
]}

Racine, G. A. ^{[3
]}

Voigt, A. ^{[2
]}

Gruetzner, G. ^{[2
]}

Brugger, J. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, Microsyst Lab LMIS1, Lausanne, Switzerland

[2] Micro Resist Technol GmbH, Berlin, Germany

[3] Ecole Polytech Fed Lausanne, Ctr Micronanotechnol CMI, CH-1015 Lausanne, Switzerland

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期

关键词：

MEMS; SU-8; RESIST; ACCELEROMETERS; PHOTORESIST; FABRICATION;

D O I：

10.1088/0960-1317/21/1/017003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.

引用

页数：6

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