Integrated Silicon-PDMS Process for Microrobot Mechanisms

被引：10

作者：

Gerratt, Aaron P. ^{[1
]}

Penskiy, Ivan ^{[1
]}

Bergbreiter, Sarah ^{[1
]}

机构：

[1] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA

来源：

2010 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION (ICRA) | 2010年

关键词：

D O I：

10.1109/ROBOT.2010.5509653

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The first MEMS process integrating soft elastomers in a standard silicon-on-insulator (SOI) wafer without assembly has been demonstrated for use in microrobotic mechanisms. This process allows silicon and poly(dimethylsiloxane) (PDMS) features to be defined in-plane with feature sizes down to 2 mu m. Test structures have been used to characterize the Young's modulus of the resulting PDMS at 1.4 MPa along with adhesion to silicon structures. In addition, compliant flexures have been designed, fabricated and characterized for eventual use in microrobot legs. Test structures have been mechanically folded 180 degrees out of plane over 60 times without failure.

引用

页码：3153 / 3158

页数：6

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