Temperature dependence of current-voltage characteristics of Ni-AlGaN/GaN Schottky diodes

被引:60
作者
Lim, Wantae [1 ]
Jeong, Jae-Hyun [1 ]
Lee, Jae-Hoon [1 ]
Hur, Seung-Bae [1 ]
Ryu, Jong-Kyu [1 ]
Kim, Ki-Se [1 ]
Kim, Tae-Hyung [2 ]
Song, Sang Yeob [2 ]
Yang, Jong-In [2 ]
Pearton, S. J. [3 ]
机构
[1] Samsung LED, GaN Power Res Grp, Suwon 443743, South Korea
[2] Samsung LED, R&D Team 1, Suwon 443743, South Korea
[3] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
关键词
FIELD-EFFECT TRANSISTORS; GAN RECTIFIERS; PERFORMANCE; MECHANISMS; DENSITY; LEAKAGE;
D O I
10.1063/1.3525931
中图分类号
O59 [应用物理学];
学科分类号
摘要
Ni-AlGaN/GaN Schottky barrier diodes (SBDs) with lateral geometry were fabricated on sapphire substrates. At 300 K, devices with 500-mu m-diameter Schottky contacts exhibited breakdown voltage (V(B)) of 765 V, forward current (I(F)) of 0.065 A at 1.5 V, and specific on-resistance (R(on)) of 81.3 m Omega cm(2), producing a figure-of-merit (V(B)(2)/R(on)) of similar to 7.2 MW cm(-2). Measured in multifinger patterns, the same parameters were 420 V, 3.2 A, 4.6 m Omega cm(2), and 38.4 MW cm(-2), respectively, at 300 K. With the increase in measurement temperature from 300 to 450 K, SBDs with dimensions of 3000 x 3000 mu m(2) showed larger effective barrier heights (0.8 eV at 300 K and 1.27 eV at 475 K) and a slightly negative temperature coefficient (-0.48 V K(-1)) for reverse breakdown voltage, while there was a little change in reverse leakage current. These results show the strong influence of barrier height inhomogeneity on the temperature dependence of apparent barrier heights obtained through current-voltage measurements. (C) 2010 American Institute of Physics. [doi:10.1063/1.3525931]
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页数:3
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