Laser beam soldering -: a new assembly technology for microoptical systems

被引：25

作者：

Banse, H

Beckert, E

Eberhardt, R

Stöckl, W

Vogel, J

机构：

[1] Fraunhofer IOF, D-07745 Jena, Germany

[2] Am Angew Micromesstech GmbH, D-12489 Berlin, Germany

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2005年 / 11卷 / 2-3期

关键词：

Laser Beam; Operating Procedure; Industrial Application; Mechanical Stress; Layer System;

D O I：

10.1007/s00542-004-0451-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Based on the development of an adhering and solderable layer system microoptical subsystems are joined by laser beam soldering. Fluxless processing with AuSn - solder (80/20 weight%) results in joints that are stable, leak-proof and that contain low mechanical stress REM - investigations show that the joining area is homogenous. The paper will discuss a number of industrial applications.

引用

页码：186 / 193

页数：8