Special Session: Hot Topic Design and Test of 3D and Emerging Memories

被引：0
|
作者：
Wu, Cheng-Wen [1 ]
机构：
[1] Natl Tsing Hua Univ, ITRI, Hsinchu, Taiwan
来源：
2011 IEEE 29TH VLSI TEST SYMPOSIUM (VTS) | 2011年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：328 / 328
页数：1
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