Microstructural Evolution of Infrared Brazed CP-Ti Using Ti-Cu-Ni Brazes

被引:15
作者
Chang, C. T. [2 ]
Yeh, T. Y. [1 ]
Shiue, R. K. [1 ]
Chang, C. S. [3 ]
机构
[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan
[2] Natl Hualien Ind Vocat Senior High Sch, Dept Mech Engn, Hualien 970, Taiwan
[3] Engineered Mat Solut, Attleboro, MA 02703 USA
关键词
Infrared Brazing; CP-Ti; Ti-Cu-Ni fillers; Microstructure;
D O I
10.1016/S1005-0302(11)60038-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Microstructural evolution of infrared vacuum brazed CP-Ti using two Ti-based braze alloys, Ti-15Cu-15Ni and Ti-15Cu-25Ni, has been investigated. The infrared brazed joint consisted of eutectic Ti2Cu/Ti2Ni intermetallic compounds and Ti-rich matrix. The eutectic Ti2Cu/Ti2Ni intermetallic compounds disappeared from the joint after being annealed at 900 degrees C for 1 h. In contrast, the depletion rate of both Cu and Ni from the braze alloy into CP-Ti substrate at 750 degrees C annealing was greatly decreased as compared with that annealed at 900 degrees C. Blocky Ti2Cu/Ti2Ni phases were observed even if the specimen was annealed at 750 degrees C for 15 h. Because the Ni content of the Ti-15Cu-25Ni braze alloy is much higher than that of the Ti-15Cu-15Ni alloy, the amount of eutectic Ti2Cu/Ti2Ni phases in Ti-15Cu-25Ni brazed joint is more than that in Ti-15Ci-15Ni brazed joint. However, similar microstructural evolution can be obtained from the infrared brazed joint annealed at various temperatures and/or time for both filler metals.
引用
收藏
页码:131 / 138
页数:8
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