The microfabrication of capacitive ultrasonic transducers

被引：0

作者：

Jin, XC

Ladabaum, I

KhuriYakub, BT

机构：

来源：

TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 1997年

关键词：

micromachining; ultrasonic transducer; capacitive transducer;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The successful fabrication of surface micromachined ultrasonic transducers is reported. In a key step of the microfabrication, amorphous silicon is used as a sacrificial layer to form sealed nitride cavities. The process is fully CMOS compatible and allows for improved geometric control compared to previously reported work. Transmission experiments in both water and air are presented. A dynamic range in excess of 110dB is observed in air at 2.3MHz. In water, a single pair of transducers is able to operate from 2MHz to 20MHz. When tuned, a 3MHz tone burst results in a received signal with better than 80dB signal to noise ratio. The transducer behavior agrees with theoretical understanding of transducer dynamics.

引用

页码：437 / 440

页数：4

共 50 条

[11] Fabrication and characterization of surface micromachined capacitive ultrasonic immersion transducers [J].

Jin, XC ;

Ladabaum, I ;

Degertekin, FL ;

Calmes, S ;

Khuri-Yakub, BT .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (01) :100-114

[12] Fabrication of capacitive micromechanical ultrasonic transducers by low-temperature process [J].

Memmi, D ;

Foglietti, V ;

Cianci, E ;

Caliano, G ;

Pappalardo, M .

SENSORS AND ACTUATORS A-PHYSICAL, 2002, 99 (1-2) :85-91

[13] Highly integrated 2-D capacitive micromachined ultrasonic transducers [J].

Calmes, S ;

Cheng, CH ;

Degertekin, FL ;

Jin, XC ;

Ergun, S ;

Khuri-Yakub, BT .

1999 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 1999, :1163-1166

[14] Micromachined capacitive ultrasonic transducers fabricated using silicon on insulator wafers [J].

Cianci, E ;

Foglietti, V ;

Caliano, G ;

Pappalardo, M .

MICROELECTRONIC ENGINEERING, 2002, 61-2 :1025-1029

[15] Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology [J].

Huang, YL ;

Ergun, AS ;

Hæggström, E ;

Badi, MH ;

Khuri-Yakub, BT .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2003, 12 (02) :128-137

[16] Experimental Verification and Design Guidelines for Efficient Ultrasonic Power Transfer Using Capacitive Parametric Ultrasonic Transducers [J].

Wei, Charles ;

Surappa, Sushruta ;

Degertekin, F. Levent .

PROCEEDINGS OF THE 2020 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2020,

[17] Fabrication of capacitive ultrasonic transducers by a low temperature and fully surface-micromachined process [J].

Cianci, E ;

Foglietti, V ;

Memmi, D ;

Caliano, G ;

Caronti, A ;

Pappalardo, M .

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2002, 26 (04) :347-354

[18] Micromachined capacitive ultrasonic immersion transducer for medical imaging [J].

Jin, XC ;

Khuri-Yakub, BT ;

Degertekin, FL ;

Ladabaum, I ;

Calmes, S .

PROCEEDINGS OF THE 20TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOL 20, PTS 1-6: BIOMEDICAL ENGINEERING TOWARDS THE YEAR 2000 AND BEYOND, 1998, 20 :779-782

[19] Capacitive transducers with curved electrodes [J].

McIntosh, RB ;

Mauger, PE ;

Patterson, SR .

IEEE SENSORS JOURNAL, 2006, 6 (01) :125-138

[20] A Family of Seismometers with Capacitive Transducers [J].

Bashilov, I. P. ;

Volosov, S. G. ;

Korolev, S. A. ;

Merkulov, V. A. ;

Ovchinnikov, V. M. .

SEISMIC INSTRUMENTS, 2018, 54 (05) :543-550

← 1 2 3 4 5 →