共 5 条
[3]
NAGY C, 1995, MICROWAVE J, V38, P22
[4]
RAO R, 1997, MICROELECTRONICS PAC, P190
[5]
FINE PITCH WIRE BONDING DEVELOPMENT USING A NEW MULTIPURPOSE, MULTIPAD PITCH TEST DIE
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1991, 14 (04)
:680-690