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Bond strength and bond mechanism of injection over-molded woven carbon fiber/PEEK-short carbon fiber/PEEK composite components
被引:11
作者:
Deng, Tianzhengxiong
[1
]
Huang, Zhigao
[1
]
Zheng, Bing
[1
]
Jiang, Wei
[1
]
Chen, Lu
[1
]
Chen, Cheng
[1
]
Zhou, Helezi
[1
]
Zhou, Huamin
[1
]
机构:
[1] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, State Key Lab Mat Proc & Die & Mold Technol, Wuhan 430074, Peoples R China
基金:
中国国家自然科学基金;
关键词:
adhesives;
composites;
structure-property relationships;
surfaces and interfaces;
thermoplastics;
ETHER-KETONE;
INTERFACE;
CRYSTALLIZATION;
BEHAVIOR;
PEEK;
CRYSTALLINITY;
POLYPROPYLENE;
POLYMERS;
FIBERS;
D O I:
10.1002/app.53222
中图分类号:
O63 [高分子化学(高聚物)];
学科分类号:
070305 ;
080501 ;
081704 ;
摘要:
A weak interface is formed between injected plastic and substrate during the injection over-molding process. This study investigated the effects of mold temperature and melt temperature on the bond strength of injection over-molded components, which were produced by injecting short carbon fiber reinforced polyether-ether-ketone (SCF/PEEK) onto the surface of woven carbon fiber reinforced PEEK (WCF/PEEK) laminate substrate. The results show that the interfacial laminar shear strength (ILSS) increases significantly from 15.8 to 50.0 MPa as the mold temperature raises from 190 to 260 degrees C. The ILSS increases first and then decreases with melt temperature raises from 380 to 420 degrees C, achieving a maximum value of 44.4 MPa at 410 degrees C melt temperature. Crystallinity analysis and microscopic observations indicate different bonding modes are formed at the interface. The matrix tangling appears in the matrix enrichment area, interlocking, and tangling appear in the pits and weak tangling and cracks occur on the fiber surface. The mold temperature affects the ILSS by changing the crystallization property and the connection mode in the interface, while the melt temperature affects the ILSS by changing the area of the matrix entanglement. The relationship between the process conditions-interfacial microstructure-interfacial mechanical performance was discussed.
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页数:13
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