Progress on silicon combined with packaging technologies will be leading the innovation on Automotive Electronic Systems. New packages and advanced chip allow the migration from system on chip to system on package or mixed System Integration. Decentralized systems, more and more adopted in automotive architecture, may be implemented without feeling squeezed for cost reductions, performances and design resources. Usage of Silicon based drivers for DC motors is imperative for a better management of high current transient across the motor and to achieve safety requirement of the automotive systems. This Paper shows the performance and benefits of using devices based on Mixed System Integration. A specific application - Power Window Motor - is discussed providing the potential architecture of a control unit based on a new multi-island package with optimized chip set and embedded STM proprietary firmware. All technical aspects including thermal and functional are discussed.
